Joint Modules HJ2 Series

Leadshine HJ2 series harmonic gear actuators integrate high torque density, closed - loop protection control, modular design, and open protocol compatibility. Equipped with long-life harmonic drives for stable and efficient operation. Motors, reducers, and encoders are integrated for flexible motion control.  Available in 52, 70, 80, 90, 110 mm sizes.

Highlights

Universal Modules, Ultra-Thin and Lightweight

Compatible with various humanoid robot structures, supporting rapid deployment and multi-joint expansion. Integrated design reduces overall weight by 65%, enabling more flexible movement.

20% Volume Reduction, More Compact Structure

Motor, drive, and encoder are integrated into a single package, simplifying system wiring and assembly.

High Torque Density

Structural weight optimization doubles the torque density.

Dual Heat Dissipation Design, Sustained High Performance

Self-developed FM2 frameless torque motor generates ‌25% less heat‌ than market equivalents, with excellent thermal conductivity from aluminum alloy material.

Precision Control

Built-in 24-bit high-resolution encoder and optimized algorithms enable higher precision in robotic motion control.

30% Price Reduction, Breaking Cost Barriers

Truly delivering "high-end performance at an affordable price."

Main Advantages

Multiple Communication Interfaces

Supports EtherCAT/CANFD high-speed industrial buses, enabling millisecond-level real-time control and multi-axis coordination for faster system response.

High Torque Density

Optimized structural weight reduction doubles the torque density.

Dual Heat Dissipation & Ultra-Long Endurance

Efficient energy conversion reduces system losses and temperature rise, improving operational stability and runtime.

Lightweight Design

Combines compact structure with high-strength lightweight materials, achieving a 65% overall weight reduction to support system lightweighting and energy efficiency.

Ultra-Thin Profile

Ultra-thin design reduces volume by 20%, making it adaptable to more compact devices for greater integration flexibility.