CIAA Global
Three-axis linear motor stage

Three-axis linear motor stage

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Model: Motion stage

Brand: HAN'S MOTOR

Origin: China

Min. Order (MOQ)

1

Lead Time

2 Weeks

Product Overview:

High-precision three-axis linear motor stage for X, Y, Z linear motion. Ideal for semiconductor wafer dicing, die bonding, laser marking, cutting, engraving, and drilling. Delivers reliable accuracy and dynamic performance for industrial applications.

Product Description

High-precision three-axis linear motor stage for X, Y, Z linear motion. Ideal for semiconductor wafer dicing, die bonding, laser marking, cutting, engraving, and drilling. Delivers reliable accuracy and dynamic performance for industrial applications.

Product Detail

 

Feature:

1. High-Precision Optical Encoder – Equipped with Lamotion optical encoder (Renishaw encoder optional) for accurate position feedback.

2.Imported THK Linear Guides – Ensures smooth, stable, and reliable X/Y/Z axis motion.

3.Integrated ACS Motor-Drive System – Imported system delivers high-dynamic performance and precise control.

4.Ultra-High Repeatability – Achieves repeat accuracy up to ±1 µm within any 500 mm stroke.

5.Flexible Stroke Options – Effective stroke available from 100 mm to 500 mm to meet diverse application needs.

6.Comprehensive Support – Free product manual, 3D model, and technical documentation available for download.

 

Highlights:

· Precision Motion Control – Achieve ultra-accurate X/Y/Z linear movement with ±1 µm repeatability.

· High-Quality Components – Features Lamotion optical encoder (Renishaw optional), THK linear guides, and ACS integrated motor-drive system for superior performance.

· Flexible Stroke Options – Available in 100–500 mm stroke lengths to suit diverse industrial applications.

· Versatile Industrial Applications – Ideal for semiconductor wafer dicing, die bonding, wire bonding, laser marking, cutting, engraving, drilling, and scribing.

· Comprehensive Documentation – Free product manual and 3D model provided for easy integration and setup.

 

Application:

It is widely used in semiconductor wafer dicing、die bonders & wire bonders、laser marking、laser cutting、laser engraving、laser drilling、laser scribing.

 

Specification

Item X-axis Y-axis Z-axis
Limit Stroke (mm) 270 270 10
Load (kg) 30 15 5
Speed (mm/s) 200 200 10
Max.Acc.(m/s2) 5 5 5
Repeat accuracy (μm) ±2 ±2 ±5
Positioning Accuracy
(μm) (after calibration)
±3 ±3 ±10
Straightness (μm) ±3 ±3 ±3
Verticality  (μm) ±5
Encoder Resolution (μm) 0.5 0.5 /
Guide rail THK
Photoelectric swtich OMRN (NPN)

 

Product Structure

Brand Logo

Shenzhen Han’s Motor S&T Co., Ltd

Global Provider